Stellantis N.V. and Hon Hai Technology Group (Foxconn) have announced the creation of SiliconAuto - a 50:50 joint venture dedicated to designing and supplying state-of-the-art semiconductors to the global automotive industry starting in 2026.
The JV combines Foxconn's development capabilities and domain expertise in the ICT industry with Stellantis' deep understanding of diverse mobility needs around the world, according to the partners.
SiliconAuto will provide customers an auto industry-centric source of semiconductors for the growing number of computer-controlled features and modules, particularly those needed for electric vehicles, the companies add.
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Products from SiliconAuto will support the future semiconductor needs of Stellantis, Foxconn and other customers, including STLA Brain, Stellantis' new electrical,electronic and software architecture with full over-the-air updating capabilities.
"Stellantis will benefit from a robust supply of essential components, which is critical to fueling the rapid, software-defined transformation of our products," said Stellantis Chief Technology Officer Ned Curic.
"Our goal is to build vehicles that seamlessly connect with our customers' daily lives and deliver class-leading capabilities years after they leave the assembly line. With this joint venture, we can create purpose-built innovations with an efficient partnership", he added.
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"We look forward to a future of extraordinary EV mobility underpinned by the vertical integration capabilities and resources SiliconAuto secures for our partners," said Foxconn Chief Product Officer Jerry Hsiao. "The collaborative energy will propel our customers to become more competitive."
SiliconAuto will be headquartered in the Netherlands. Stellantis has said that it will provide input to SiliconAuto to enable and deliver capabilities needed by future battery electric vehicles and multi-energy vehicle platforms.