Global semiconductor firm STMicroelectronics will supply BorgWarner with the latest third generation 750V silicon carbide (SiC) power MOSFETs dice for their proprietary 'Viper' based power module.
The said power module is used in BorgWarner's traction inverter platforms designed for several current and future Volvo Cars BEVs. The latest collaboration enables high-volume capability that is required by the quickly growing EV market, the companies claim.
Commenting on the development, Marco Monti, President, Automotive and Discrete Group, STMicroelectronics, said "Our collaboration with BorgWarner, a leading global automotive supplier in electrification, will enable Volvo Cars to offer their customers superior vehicle performance and range".
"We are committed to expanding SiC capacity and to reinforcing our SiC supply, including through vertical integration, as we ramp up volumes to support our global automotive and industrial customers in their shift to electrification and higher efficiency", he added.
To fully leverage the performance of ST's SiC MOSFET dice, BorgWarner claims to have collaborated closely with ST's technical team to match their die with its 'Vipe'r power switch, thereby maximizing inverter performance and delivering a compact and cost-effective architecture.
"BorgWarner is pleased to partner with ST to supply our longstanding customer Volvo Cars with inverters for their next generation of BEV platforms," said Stefan Demmerle, Vice President of BorgWarner Inc. and President and General Manager, PowerDrive Systems.
Volvo Cars' COO and Deputy CEO Javier Varela noted, "This collaboration will give Volvo Cars the opportunity to further increase the attractiveness of our electrical vehicles with longer range and faster charging. It will also support us on our journey towards being fully electric by 2030 and strengthen our increased vertical integration and our control of critical components".
The high-volume SiC products are manufactured at STMicroelectronics' facilities in Italy and Singapore, with advanced packaging and testing at its back-end facilities in Morocco and China.
In October last year, the chip manufacturer expanded its manufacturing capacity with a new integrated SiC substrate manufacturing facility in Catania, home to the company's power semiconductor expertise and the site of integrated research, development, and manufacturing of SiC.
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